<div><span style="font-size:14.6667px;">Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology.  The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases.  Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon.  For more information, visit </span><a href="https://gcc02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.bomaterials.com%2F&amp;data=05%7C02%7CNada%40bomaterials.com%7C6c71abef94d942e7c47308de1d6e2406%7Cb373d8a9bbdf4f0e846fd237b2968e09%7C0%7C0%7C638980556070784854%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&amp;sdata=T%2FOLjXphVid3rSyFefLdFqEf%2BF3SrO8FdaK%2FCXpLmt0%3D&amp;reserved=0" style="font-size:14.6667px;">https://www.bomaterials.com/</a></div><div> </div><div> </div><div><strong>THE OPPORTUNITY</strong></div><div>A career-defining opportunity rarely offers all of the following:</div><div> </div><div><strong>Direct connection to the mission.  </strong>Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact. </div><div><strong> </strong></div><div><strong>Growth beyond a single role.  </strong>At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization. </div><div><strong> </strong></div><div><strong>Work on problems that matter.  </strong>Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.  Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us. </div><div><br></div><div><p><strong><span>The Role</span></strong></p><p><span>We are seeking a highly motivated Field Applications Engineer to serve as the primary technical partner for our customers in Taiwan as they evaluate and adopt our high-performance thermal interface material (TIM) products. </span><span> </span>The role is based in Taipei, Taiwan-remote with frequent on-site customer visits.</p></div><div><p><span>This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. </span><span> </span></p></div><div><p><span>This position offers the opportunity to work closely with hyperscalers, ODMs, OSATs, and foundries to influence the adoption of cutting-edge thermal solutions in next-generation AI and HPC silicon and data center systems.</span><span>  </span></p></div><div><p><span>Join us to solve one of the most critical challenges facing AI Infrastructure and High Performance Computing – thermal management!  </span><span> </span></p></div><br><br><h3>Your Responsibilities</h3><ul><div><ul style="list-style-type:disc;"><li>Act as the primary technical point of contact for ODM, OSAT, and Foundry customers, leading the on-site technical integration of our liquid-metal TIMs during early and mid-stage engagements. </li><li>Support customer assembly and testing trials, locally coordinating mechanical and reliability testing to validate mass production feasibility, while troubleshooting technical issues in real-time with internal teams. </li><li>Work closely with the business development team to uncover and document precise customer technical requirements, including geometric, load, assembly constraints, thermal budgets, and reliability standards. </li><li>Capture customer feedback and synthesize technical insights to support the US-based R&amp;D team in continuous product improvement and roadmap planning. </li><li>Prepare and deliver critical technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes. </li><li>Document designs for customer coordination and lead local efforts to fabricate provisions and mockups (either internally or externally) to ensure customer schedules are met. </li></ul></div></ul><h3>Your Skills and Expertise </h3><ul><div><ul style="list-style-type:disc;"><li>Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.  </li><li>CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation.  </li><li>3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company.  </li><li>Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.).  </li><li>Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.  </li><li>Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.  </li><li>Experience with design and fabrication of elastomeric materials is a plus.  </li><li>Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus. </li><li>Bilingual proficiency in Mandarin and English (both written and spoken) to effectively act as the primary liaison between customers and our US-based engineering teams. </li></ul></div></ul><h3>Summary of Benefits</h3><ul><div><li>Competitive Compensation: Salary and benefits package fully compliant with the Taiwan Labor Standards Act (LSA). </li><li>Health &amp; Security: Comprehensive coverage including mandatory enrollment in Taiwan’s National Health Insurance (NHI) and Labor Insurance systems. </li><li>Culture &amp; Integration: Full integration into the Boston Materials global engineering team, including direct access to HQ leadership and internal product development resources. </li></div></ul><h3></h3><ul><div><div><p><span>Boston Materials </span><span>利用其專利的</span><span> Z </span><span>軸碳纖維技術，開發具備強化能量傳導特性的先進材料。公司產品可解決橫跨散熱、導電與結構應用等領域中的關鍵效能瓶頸。其突破性的</span><span> Liquid Metal ZRT </span><span>導熱介面材料（</span><span>TIM</span><span>），專為最嚴苛的</span><span> AI </span><span>基礎設施需求而設計。</span><span>Boston Materials </span><span>致力於在美國擴展高量產製造能力。更多資訊請參閱：</span><a href="https://www.bomaterials.com/"><span>https://www.bomaterials.com/</span></a><span> </span></p></div><div><p><span>關於這個機會</span><span>: </span><span>在職涯中，很少有機會能夠</span><span> </span></p></div><div><p><span>深入參與使命</span><span> </span></p></div><div><p><span>真正理解公司的核心業務，以及我們的工作如何直接影響成果。在這裡，每個人都與公司的成功息息相關。沒有層層架構、沒有部門隔閡、沒有繁瑣官僚流程，只有最大影響力與最高責任感的機會。</span><span> </span></p></div><div><p><span>更快速地推進事情</span><span> </span></p></div><div><p><span>以極快速度因應市場變化。不需要多層級核准與冗長流程，而是擁有足夠空間，快速推動新想法、新產品或新流程落地。我們鼓勵實驗與測試新點子，因為我們所創造的，是客戶真正重視的解決方案，而客戶不會等待我們慢慢摸索。</span><span> </span></p></div><div><p><span>超越職位框架</span><span> </span></p></div><div><p><span>我們不被過去經驗定義，也不受限於現有職務內容。每天都有機會發揮影響力並接受新挑戰。與業界頂尖人才並肩合作，我們能夠展現自身能力、擴展知識、培養新技能，並主動承擔責任，同時為公司的整體成功做出貢獻。</span><span> </span></p></div><div><p><span>創造關鍵解決方案</span><span> </span></p></div><div><p><span>加入我們，一同解決先進半導體、</span><span>AI </span><span>基礎設施與先進材料產業所面臨的最關鍵挑戰。</span><span> </span></p></div><div><p><span>機會就在</span><span> Boston Materials</span><span>。你願意接受挑戰嗎？</span><span> </span></p></div><div><p><span> </span></p></div><div><p><span> </span></p></div><div><p><span>職位內容</span><span> </span></p></div><div><p><span>我們正在尋找一位高度積極且具備技術能力的「台灣資深應用工程師（</span><span>Senior Applications Engineer – Taiwan</span><span>）」，作為台灣客戶在評估與導入我們高效能導熱介面材料（</span><span>TIM</span><span>）產品時的主要技術合作夥伴。</span><span> </span></p></div><div><p><span>這個職位非常適合喜歡處於客戶互動、問題解決與產品效能驗證交會點的工程師。您將負責主導客戶前期至中期的技術互動，蒐集並轉化客戶需求為可執行的技術工作，並確保客戶獲得所需的數據、樣品與技術支援，以成功完成</span><span> TIM </span><span>產品於先進半導體封裝應用中的整合與認證。</span><span> </span></p></div><div><p><span>此職位將有機會與</span><span> Hyperscaler、ODM </span><span>與</span><span> OSAT </span><span>密切合作，並影響下一代</span><span> AI </span><span>與資料中心系統中尖端散熱解決方案的採用。</span><span> </span></p></div><div><p><span>加入我們，一同解決半導體與電子產業最關鍵的挑戰之一</span><span>——</span><span>熱管理！</span><span> </span></p></div><div><p><span>工作地點</span><span> </span></p></div><div><p><span>台灣台北（</span><span>Remote </span><span>遠端工作為主，需頻繁拜訪客戶現場）</span><span> </span></p></div><div><p><span>工作職責</span><span> </span></p></div><div><p><span>• </span><span>擔任</span><span> ODM、OSAT </span><span>與</span><span> Foundry </span><span>客戶的主要技術窗口，主導液態金屬</span><span> TIM </span><span>在客戶端前期與中期導入階段的現場技術整合。</span> <br><span>• </span><span>支援客戶組裝與測試驗證，於當地協調機構與可靠度測試，驗證量產可行性，並與內部團隊即時排除技術問題。</span> <br><span>• </span><span>與業務開發團隊密切合作，挖掘並整理客戶精確的技術需求，包括幾何尺寸、受力、組裝限制、熱設計預算與可靠度標準。</span> <br><span>• </span><span>蒐集客戶回饋並整合技術洞察，支援美國研發團隊持續改善產品與規劃技術藍圖。</span> <br><span>• </span><span>準備並提供關鍵技術資料，例如應用說明、設計指南與測試報告，以支援客戶決策與認證流程。</span> <br><span>• </span><span>建立客戶協作所需的設計文件，並主導當地樣品與</span><span> mockup </span><span>製作（內部或外部），以確保客戶時程順利推進。</span><span> </span></p></div><div><p><span> </span></p></div><div><p><span> </span></p></div><div><p><span>技能與專業條件</span><span> </span></p></div><div><p><span>• </span><span>機械工程、材料科學、電機工程或相關領域學士或碩士學位。</span> <br><span>• </span><span>具備</span><span> CAD </span><span>建模與製圖、實作原型開發、機械與熱測試、數據分析及報告撰寫經驗。</span> <br><span>• </span><span>具備</span><span> 3–7 </span><span>年半導體封裝、電子組裝、導熱介面材料或</span><span> B2B </span><span>技術產品公司應用工程相關經驗。</span> <br><span>• </span><span>深入理解系統層級處理器封裝與熱設計（包括冷板、</span><span>stiffener/lid </span><span>設計、</span><span>TIM1/TIM1.5/TIM2 </span><span>選型）以及相關可靠度測試（</span><span>uHAST、TCT、HTS </span><span>等）。</span> <br><span>• </span><span>具備跨部門技術專案主導能力，並能如期交付客製化解決方案。</span> <br><span>• </span><span>優秀溝通能力，能向工程師與非技術背景人士清楚解釋複雜技術議題。</span> <br><span>• </span><span>具彈性體材料設計與製作經驗者加分。</span> <br><span>• </span><span>熟悉</span><span> thermal test setup、C-SAM、X-ray </span><span>或</span><span> FEA </span><span>模擬工具者加分。</span> <br><span>• </span><span>中英文雙語流利（口說與書寫），能有效擔任客戶與美國工程團隊之間的主要溝通橋樑。</span><span> </span></p></div><div><p><span>福利摘要</span><span> </span></p></div><div><p><span>• </span><span>具競爭力的薪資與福利方案，完全符合台灣《勞動基準法》。</span> <br><span>• </span><span>健康與保障：完整納入台灣全民健康保險（</span><span>NHI</span><span>）與勞工保險制度。</span> <br><span>• </span><span>團隊文化與整合：完整融入</span><span> Boston Materials </span><span>全球工程團隊，可直接接觸總部高層與內部產品開發資源。</span><span> </span></p></div><div><p><span>Boston Materials </span><span>為平等就業機會雇主（</span><span>EOE</span><span>），並位於材料創新的最前線。我們相信，多元背景與經驗所組成的團隊，是推動創新的關鍵。我們致力於提供平等就業機會，不因種族、膚色、宗教、性別、國籍、年齡、性傾向、性別認同、性別表達、婚姻狀況、退伍軍人身份或身心障礙而有所差別待遇。</span><span> </span></p></div><div><p><span>應徵者必須目前已具備在台灣合法全職工作的資格。</span><span> </span></p></div></div></ul><br><div>Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.</div><div> </div><div><span>Applicants must be currently authorized to work in Taiwan on a full-time basis.</span><span> </span></div>

<p>Boston Materials empowers leaders in the electronics, transportation, and energy sectors to overcome their design limitations with new materials.</p>
<p>The company's patented Z-axis Fiber&trade; is a lightweight, corrosion-resistant material with exceptional energy-diffusion capabilities (including thermal, electrical, and structural loads.) It is created entirely from reclaimed carbon fiber, allowing for high-performance, high-volume materials and components with the lowest possible carbon footprint.</p>

Field Application Engineer

<div><span>Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology.  The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases.  Its breakthrough Liquid Metal ZRT thermal interface material is designed to solve thermal chokepoints that are facing the next generation of AI and HPC silicon.  For more information, visit </span><a href="https://gcc02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fwww.bomaterials.com%2F&amp;data=05%7C02%7CNada%40bomaterials.com%7C6c71abef94d942e7c47308de1d6e2406%7Cb373d8a9bbdf4f0e846fd237b2968e09%7C0%7C0%7C638980556070784854%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&amp;sdata=T%2FOLjXphVid3rSyFefLdFqEf%2BF3SrO8FdaK%2FCXpLmt0%3D&amp;reserved=0">https://www.bomaterials.com/</a></div><div> </div><div> </div><div><strong>THE OPPORTUNITY</strong></div><div>A career-defining opportunity rarely offers all of the following:</div><div> </div><div><strong>Direct connection to the mission.  </strong>Gain a clear understanding of the business and see how your work directly shapes outcomes. With no unnecessary layers, silos, or bureaucracy, every team member contributes meaningfully to the company's success and has the responsibility to drive real impact. </div><div><strong> </strong></div><div><strong>Growth beyond a single role.  </strong>At Boston Materials, you are not defined by your past experience or limited by a job description. Working alongside leading experts in the field, you will take on new challenges, broaden your expertise, develop new capabilities, and take ownership of projects that matter – while contributing to the broader success of the organization. </div><div><strong> </strong></div><div><strong>Work on problems that matter.  </strong>Help solve some of the most pressing challenges in the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.  Boston Materials offers a rare combination of purpose, autonomy, and impact. We invite you to join us. </div><div><br /></div><div><p><strong><span>The Role</span></strong></p><p><span>We are seeking a highly motivated Field Applications Engineer to serve as the primary technical partner for our customers in Taiwan as they evaluate and adopt our high-performance thermal interface material (TIM) products. </span><span> </span>The role is based in Taipei, Taiwan-remote with frequent on-site customer visits.</p></div><div><p><span>This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. </span><span> </span></p></div><div><p><span>This position offers the opportunity to work closely with hyperscalers, ODMs, OSATs, and foundries to influence the adoption of cutting-edge thermal solutions in next-generation AI and HPC silicon and data center systems.</span><span>  </span></p></div><div><p><span>Join us to solve one of the most critical challenges facing AI Infrastructure and High Performance Computing – thermal management!  </span><span> </span></p></div><br /><br /><h3>Your Responsibilities</h3><ul><div><ul><li>Act as the primary technical point of contact for ODM, OSAT, and Foundry customers, leading the on-site technical integration of our liquid-metal TIMs during early and mid-stage engagements. </li><li>Support customer assembly and testing trials, locally coordinating mechanical and reliability testing to validate mass production feasibility, while troubleshooting technical issues in real-time with internal teams. </li><li>Work closely with the business development team to uncover and document precise customer technical requirements, including geometric, load, assembly constraints, thermal budgets, and reliability standards. </li><li>Capture customer feedback and synthesize technical insights to support the US-based R&amp;D team in continuous product improvement and roadmap planning. </li><li>Prepare and deliver critical technical content such as application notes, design guides, and data reports to support customer decision-making and qualification processes. </li><li>Document designs for customer coordination and lead local efforts to fabricate provisions and mockups (either internally or externally) to ensure customer schedules are met. </li></ul></div></ul><h3>Your Skills and Expertise </h3><ul><div><ul><li>Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.  </li><li>CAD modeling and drafting, hands-on experience prototyping, mechanical and thermal testing, data analysis, and report generation.  </li><li>3–7 years of experience in semiconductor packaging, electronics assembly, thermal interface materials, or applications engineering in a B2B technical product company.  </li><li>Strong understanding of system-level processor packaging/thermal design (cold plate and stiffener/lid design, TIM1/TIM1.5/TIM2 selection) and associated reliability testing (uHAST, TCT, HTS, etc.).  </li><li>Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.  </li><li>Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.  </li><li>Experience with design and fabrication of elastomeric materials is a plus.  </li><li>Familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus. </li><li>Bilingual proficiency in Mandarin and English (both written and spoken) to effectively act as the primary liaison between customers and our US-based engineering teams. </li></ul></div></ul><h3>Summary of Benefits</h3><ul><div><li>Competitive Compensation: Salary and benefits package fully compliant with the Taiwan Labor Standards Act (LSA). </li><li>Health &amp; Security: Comprehensive coverage including mandatory enrollment in Taiwan’s National Health Insurance (NHI) and Labor Insurance systems. </li><li>Culture &amp; Integration: Full integration into the Boston Materials global engineering team, including direct access to HQ leadership and internal product development resources. </li></div></ul><h3></h3><ul><div><div><p><span>Boston Materials </span><span>利用其專利的</span><span> Z </span><span>軸碳纖維技術，開發具備強化能量傳導特性的先進材料。公司產品可解決橫跨散熱、導電與結構應用等領域中的關鍵效能瓶頸。其突破性的</span><span> Liquid Metal ZRT </span><span>導熱介面材料（</span><span>TIM</span><span>），專為最嚴苛的</span><span> AI </span><span>基礎設施需求而設計。</span><span>Boston Materials </span><span>致力於在美國擴展高量產製造能力。更多資訊請參閱：</span><a href="https://www.bomaterials.com/"><span>https://www.bomaterials.com/</span></a><span> </span></p></div><div><p><span>關於這個機會</span><span>: </span><span>在職涯中，很少有機會能夠</span><span> </span></p></div><div><p><span>深入參與使命</span><span> </span></p></div><div><p><span>真正理解公司的核心業務，以及我們的工作如何直接影響成果。在這裡，每個人都與公司的成功息息相關。沒有層層架構、沒有部門隔閡、沒有繁瑣官僚流程，只有最大影響力與最高責任感的機會。</span><span> </span></p></div><div><p><span>更快速地推進事情</span><span> </span></p></div><div><p><span>以極快速度因應市場變化。不需要多層級核准與冗長流程，而是擁有足夠空間，快速推動新想法、新產品或新流程落地。我們鼓勵實驗與測試新點子，因為我們所創造的，是客戶真正重視的解決方案，而客戶不會等待我們慢慢摸索。</span><span> </span></p></div><div><p><span>超越職位框架</span><span> </span></p></div><div><p><span>我們不被過去經驗定義，也不受限於現有職務內容。每天都有機會發揮影響力並接受新挑戰。與業界頂尖人才並肩合作，我們能夠展現自身能力、擴展知識、培養新技能，並主動承擔責任，同時為公司的整體成功做出貢獻。</span><span> </span></p></div><div><p><span>創造關鍵解決方案</span><span> </span></p></div><div><p><span>加入我們，一同解決先進半導體、</span><span>AI </span><span>基礎設施與先進材料產業所面臨的最關鍵挑戰。</span><span> </span></p></div><div><p><span>機會就在</span><span> Boston Materials</span><span>。你願意接受挑戰嗎？</span><span> </span></p></div><div><p><span> </span></p></div><div><p><span> </span></p></div><div><p><span>職位內容</span><span> </span></p></div><div><p><span>我們正在尋找一位高度積極且具備技術能力的「台灣資深應用工程師（</span><span>Senior Applications Engineer – Taiwan</span><span>）」，作為台灣客戶在評估與導入我們高效能導熱介面材料（</span><span>TIM</span><span>）產品時的主要技術合作夥伴。</span><span> </span></p></div><div><p><span>這個職位非常適合喜歡處於客戶互動、問題解決與產品效能驗證交會點的工程師。您將負責主導客戶前期至中期的技術互動，蒐集並轉化客戶需求為可執行的技術工作，並確保客戶獲得所需的數據、樣品與技術支援，以成功完成</span><span> TIM </span><span>產品於先進半導體封裝應用中的整合與認證。</span><span> </span></p></div><div><p><span>此職位將有機會與</span><span> Hyperscaler、ODM </span><span>與</span><span> OSAT </span><span>密切合作，並影響下一代</span><span> AI </span><span>與資料中心系統中尖端散熱解決方案的採用。</span><span> </span></p></div><div><p><span>加入我們，一同解決半導體與電子產業最關鍵的挑戰之一</span><span>——</span><span>熱管理！</span><span> </span></p></div><div><p><span>工作地點</span><span> </span></p></div><div><p><span>台灣台北（</span><span>Remote </span><span>遠端工作為主，需頻繁拜訪客戶現場）</span><span> </span></p></div><div><p><span>工作職責</span><span> </span></p></div><div><p><span>• </span><span>擔任</span><span> ODM、OSAT </span><span>與</span><span> Foundry </span><span>客戶的主要技術窗口，主導液態金屬</span><span> TIM </span><span>在客戶端前期與中期導入階段的現場技術整合。</span> <br /><span>• </span><span>支援客戶組裝與測試驗證，於當地協調機構與可靠度測試，驗證量產可行性，並與內部團隊即時排除技術問題。</span> <br /><span>• </span><span>與業務開發團隊密切合作，挖掘並整理客戶精確的技術需求，包括幾何尺寸、受力、組裝限制、熱設計預算與可靠度標準。</span> <br /><span>• </span><span>蒐集客戶回饋並整合技術洞察，支援美國研發團隊持續改善產品與規劃技術藍圖。</span> <br /><span>• </span><span>準備並提供關鍵技術資料，例如應用說明、設計指南與測試報告，以支援客戶決策與認證流程。</span> <br /><span>• </span><span>建立客戶協作所需的設計文件，並主導當地樣品與</span><span> mockup </span><span>製作（內部或外部），以確保客戶時程順利推進。</span><span> </span></p></div><div><p><span> </span></p></div><div><p><span> </span></p></div><div><p><span>技能與專業條件</span><span> </span></p></div><div><p><span>• </span><span>機械工程、材料科學、電機工程或相關領域學士或碩士學位。</span> <br /><span>• </span><span>具備</span><span> CAD </span><span>建模與製圖、實作原型開發、機械與熱測試、數據分析及報告撰寫經驗。</span> <br /><span>• </span><span>具備</span><span> 3–7 </span><span>年半導體封裝、電子組裝、導熱介面材料或</span><span> B2B </span><span>技術產品公司應用工程相關經驗。</span> <br /><span>• </span><span>深入理解系統層級處理器封裝與熱設計（包括冷板、</span><span>stiffener/lid </span><span>設計、</span><span>TIM1/TIM1.5/TIM2 </span><span>選型）以及相關可靠度測試（</span><span>uHAST、TCT、HTS </span><span>等）。</span> <br /><span>• </span><span>具備跨部門技術專案主導能力，並能如期交付客製化解決方案。</span> <br /><span>• </span><span>優秀溝通能力，能向工程師與非技術背景人士清楚解釋複雜技術議題。</span> <br /><span>• </span><span>具彈性體材料設計與製作經驗者加分。</span> <br /><span>• </span><span>熟悉</span><span> thermal test setup、C-SAM、X-ray </span><span>或</span><span> FEA </span><span>模擬工具者加分。</span> <br /><span>• </span><span>中英文雙語流利（口說與書寫），能有效擔任客戶與美國工程團隊之間的主要溝通橋樑。</span><span> </span></p></div><div><p><span>福利摘要</span><span> </span></p></div><div><p><span>• </span><span>具競爭力的薪資與福利方案，完全符合台灣《勞動基準法》。</span> <br /><span>• </span><span>健康與保障：完整納入台灣全民健康保險（</span><span>NHI</span><span>）與勞工保險制度。</span> <br /><span>• </span><span>團隊文化與整合：完整融入</span><span> Boston Materials </span><span>全球工程團隊，可直接接觸總部高層與內部產品開發資源。</span><span> </span></p></div><div><p><span>Boston Materials </span><span>為平等就業機會雇主（</span><span>EOE</span><span>），並位於材料創新的最前線。我們相信，多元背景與經驗所組成的團隊，是推動創新的關鍵。我們致力於提供平等就業機會，不因種族、膚色、宗教、性別、國籍、年齡、性傾向、性別認同、性別表達、婚姻狀況、退伍軍人身份或身心障礙而有所差別待遇。</span><span> </span></p></div><div><p><span>應徵者必須目前已具備在台灣合法全職工作的資格。</span><span> </span></p></div></div></ul><br /><div>Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.</div><div> </div><div><span>Applicants must be currently authorized to work in Taiwan on a full-time basis.</span><span> </span></div>

Field Application Engineer

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